ODM: Multi-Layer, Level HDI FPC, PCB & RF-PCB; 委託設計製造: 多層多階高密度互連電路軟板、硬板、軟硬結合板
6~8-L HDI PCB and 8~10-L HDI RF-PCB T-con Board for thin, narrow bezel IT/NB Display Screen; 5~6-L FPC and RF PCB Con Board for Mobile OLED Display Screen; 2~4-L FPCA for AR, VR and wearable devices.
Mini LED B/L ODM: TV, Monitor, NB, VR and Automobile display screen. Mini LED背光集成設計製造: 液晶電視, 監視器, 筆電, VR, 車載等顯示幕。
Turn-key design and fabrication of Mini LED back-light unit for various sizes of display screen. AM and PM driving, COB blue and POB white light, FPC and PCB basis are available.